PTFE Molding Powder Small Particle

Grades and Technical Properties

Item	SF-48	SF-46	SF-461	SF-462
Appearance
Tensile Strength, MPa ≥	30		35
Elongation, % ≥	300		400	350
Particle Size, μm	30-40	15-30	20-30
Bulk Density, g/L	300-480	300-450	300-500
Moisture Content, % ≤	0.03
Melting Point, ℃	327±5
Standard Specific Gravity	2.140-2.170		2.150-2.180	2.130-2.180
Electric strength, MV/m ≥	80		100
Processing Method	Molding

 

Application:

 

SF-48: It is suitable for pressing large billet, which can be processed into turning film, turning board and other products. Due to its low metal ion precipitation performance, it can be widely used in semiconductor, 5G, medical and other high-end fields.

 

SF-46: Making the film, color film and as raw material to produce free flow resin.

 

SF-461: This product is similar to DAIKIN M111 and 3M TFM1700, it's suitable for sealing gaskets, high-end pumps and valve linings with high creep resistance requirements, and has good mechanical and electrical properties, good weld-ability and low metal ion precipitation performance. It is widely used in semiconductor, 5G and other high-end fields. MIT Flexural Life (0.4 mm sheet,23℃) ,10⁴ cycle ≥200. Compression Set (23℃, 14MPa, 24h) % ≤5.0.

 

SF-462: The product is similar to DAIKIN M112 and 3M TFM1705, it's suitable for diaphragm sheet, bellows and other products with high bending resistance requirements, and has good mechanical and electrical properties, good weld-ability, low metal ion precipitation performance, widely used in semiconductor, 5G and other high-end fields. MIT Flexural Life (0.4 mm sheet,23℃) ,10⁴ cycle ≥600. Compression Set (23℃, 14MPa, 24h) % ≤6.0.

 

Packaging, Storage and Transportation:

1、Packed in double-layer plastic bag inside, and hard board drum outside. 25KG per drum.

2、Transported as non-dangerous chemical, prevent from humidity, intense vibration and package damage.

3、Stocked in clean, cool and dry warehouse, prevent from dust, moisture or other impurities.